0.8 mm board to board connector double row board to board connector
Technical Information
Pitch: 0.8mm No. of
Pins: 30~140pin
PCB welding method: SMT
Docking direction: 180 degree vertical docking
Electroplating method: gold / tin or goldflash
PCB Docking height: 5mm~20mm(16 kinds of height )
Differential impedance range: 80~110Ω 50ps(10~90%)
Insertion loss: <1.5dB 6GHz/12Gbps
Return loss: < 10dB 6GHz/12Gbps
Crosstalk: ≤ -26 dB 50ps(10~90%)
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Specifications
Durability | 100mating cycles |
Mating force | 150gf max./ Contact pair |
Unmating force | 10gf min./ Contact pair |
Operating temperature | -40℃~105 ℃ |
High temperature life | 105±2℃ 250 hour |
Constant temperature | |
and humidity | Relative humidity 90~95% 96 hours |
Insulation resistance | 100 MΩ |
Ratedcurrent | 0.5~1.5A/per pin |
Contact resistance | 50mΩ |
Rated voltage | 50V~100V AC/DC |
Concept
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Pitch | 0.80 mm |
No. of Pins | 30, 40, 50, 60, 80, 100, 120, 140 |
Termination technology | SMT |
Connectors | Male connector,Vertical Female connector,Vertical |
Special versions | Vertical docking can achieve a height of 5~20mm, and a variety of stacking heights can be selected |
Highly Reliable Terminal Design
The tapered contact point can achieve a large positive force to ensure reliable contact Unique terminal structure designed for high frequency transmission
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Insert Face Chamfer
Coined contact tips assure smooth, safe wiping action during connector mating
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Friction Distance
Larger wipe distance (1.40mm), providing contact reliability and compensating for tolerances between different heights
Fully Automatic Assembly And Reflow Soldering
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For efficient processing on modern assembly lines
Features
Housing and terminal profile guarantees support of up to 12Gb/s Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights
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Differential Lmpedance
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Insertions Loss
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Return Loss
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Near End Crosstalk (NEXT)
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