0.8 mm board to board connector double row board to board connector
Technical Information
Pitch: 0.8mm No. of
Pins: 30~140pin
PCB welding method: SMT
Docking direction: 180 degree vertical docking
Electroplating method: gold / tin or goldflash
PCB Docking height: 5mm~20mm(16 kinds of height )
Differential impedance range: 80~110Ω 50ps(10~90%)
Insertion loss: <1.5dB 6GHz/12Gbps
Return loss: < 10dB 6GHz/12Gbps
Crosstalk: ≤ -26 dB 50ps(10~90%)
Specifications
Durability | 100mating cycles |
Mating force | 150gf max./ Contact pair |
Unmating force | 10gf min./ Contact pair |
Operating temperature | -40℃~105 ℃ |
High temperature life | 105±2℃ 250 hour |
Constant temperature | |
and humidity | Relative humidity 90~95% 96 hours |
Insulation resistance | 100 MΩ |
Ratedcurrent | 0.5~1.5A/per pin |
Contact resistance | 50mΩ |
Rated voltage | 50V~100V AC/DC |
Concept
Pitch | 0.80 mm |
No. of Pins | 30, 40, 50, 60, 80, 100, 120, 140 |
Termination technology | SMT |
Connectors | Male connector,Vertical Female connector,Vertical |
Special versions | Vertical docking can achieve a height of 5~20mm, and a variety of stacking heights can be selected |
Highly Reliable Terminal Design
The tapered contact point can achieve a large positive force to ensure reliable contact Unique terminal structure designed for high frequency transmission
Insert Face Chamfer
Coined contact tips assure smooth, safe wiping action during connector mating
Friction Distance
Larger wipe distance (1.40mm), providing contact reliability and compensating for tolerances between different heights
Fully Automatic Assembly And Reflow Soldering
For efficient processing on modern assembly lines
Features
Housing and terminal profile guarantees support of up to 12Gb/s Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights