2022 High quality Board To Board Interconnect - 0.8 mm board to board connector double row board to board connector – Plastron

Technical Information

Pitch: 0.8mm No. of

Pins: 30~140pin

PCB welding method: SMT

Docking direction: 180 degree vertical docking

Electroplating method: gold / tin or goldflash

PCB Docking height: 5mm~20mm(16 kinds of height )

Differential impedance range: 80~110Ω 50ps(10~90%)

Insertion loss: ＜1.5dB 6GHz/12Gbps

Return loss: ＜ 10dB 6GHz/12Gbps

Crosstalk: ≤ -26 dB 50ps(10~90%)

Specifications

Concept

Highly Reliable Terminal Design

The tapered contact point can achieve a large positive force to ensure reliable contact Unique terminal structure designed for high frequency transmission

Insert Face Chamfer

Coined contact tips assure smooth, safe wiping action during connector mating

Friction Distance

Larger wipe distance (1.40mm), providing contact reliability and compensating for tolerances between different heights

Fully Automatic Assembly And Reflow Soldering

For efficient processing on modern assembly lines

Features

Housing and terminal profile guarantees support of up to 12Gb/s Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights

Differential Lmpedance

Insertions Loss

Return Loss

Near End Crosstalk (NEXT)

Far End Crosstalk